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Product Description
Product Description
Its primary applications include precision bonding, sealing, and coating in the manufacturing of electronics (e.g., chips and sensors), optical elements, medical devices, and decorative products. A key feature is its ability to perform UV resin doming, creating a smooth, protective, and aesthetically pleasing convex layer over components or graphics.
Beyond UV-curable materials, advanced models may integrate hot melt adhesive dispensing systems for applications requiring instant tack or bonding of heat-tolerant substrates, offering remarkable production flexibility.
The core advantages of this integrated system are rapid curing (seconds under UV light), superior process control for consistent dot lines or coated layers, enhanced final product durability, and significant gains in production efficiency and energy savings compared to traditional thermal curing methods.

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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.